Find Your Next Job
Advanced Packaging Process Integration Engineer
Posted on May 2, 2025
- Singapore, Singapore
- 0 - 0 USD (yearly)
- Full Time

Who We Are
Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.
What We Offer
Location:
Singapore,SGPAt Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.
As a Process Integration Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.
Responsibilities:
Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
Owns, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.
Experience:
Minimum 5 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.
Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.
Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.
Work Location:
- Science Park II
Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
NoRelocation Eligible:
NoApplied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
Tailor Your Resume for this Job
Share with Friends!
Similar Jobs
Avery Dennison
A Full Stack Data Scientist
Company Description About Avery Dennison Avery Dennison Corporation (NYSE: AVY) is a global materia…
Full Time | Rodange, Luxembourg
Apply 1 month ago
KLA
Senior/Staff Mechanical Design Engineer
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufactur…
Full Time | Singapore, Singapore
Apply 1 month ago
Intel Corporation
Global Yield Process Integration Development Group Leader
Job Description Join Global Yield and experience the exciting transition of Intel technology develo…
Full Time | Phoenix, United States of America
Apply 1 month ago
Applied Materials
Plasma Technology Development Process Engineer
Applied Materials is the global leader in materials engineering solutions used to produce virtually…
Full Time | Singapore, Singapore
Apply 2 months ago
KLA
Hardware Engineering Manager
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufactur…
Full Time | Singapore, Singapore
Apply 2 months, 1 week ago
Intel Corporation
System And Software Optimization Engineer - Undergrad Intern (Ai/Ml)
Job Description Embark with us on a journey of growth and transformation as we create exceptionally…
Full Time | Santa clara, United States of America
Apply 2 months, 1 week ago
Intel Corporation
Director, Foundry Customer Success, Intel Foundry Services
Job Description About the Group Intel Foundry is a systems foundry dedicated to transforming the gl…
Full Time | Az, United States of America
Apply 2 months, 4 weeks ago
Intel Corporation
Manufacturing And Process Development - College Graduate, Doctorate
Job Description Embark with us on a journey of growth and transformation as we create exceptionally…
Full Time | Hillsboro, United States of America
Apply 3 months, 2 weeks ago