Engineering Manager — Semiconductor & Semiconductor Packaging R&D

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Team Size: 15 Engineers and Scientists and growing (Semiconductor Process, Materials and Device Focus)

Location: Full time, Cork, Ireland

This is an opportunity to take up a foundational role in a growing semiconductor deep tech company working with our team of leading technologists in the field of semiconductor processing and heterogenous integration for global tier one customers and partners.

About the Company

X-Celeprint is the leading provider of Micro Transfer Printing (MTP) solutions for demanding heterogenous integration applications using MTP. We serve global OEMs, foundries and semiconductor device companies in high-growth markets such as Datacom, High-performance Compute/AI, Datacentre/Storage and Consumer. We are headquartered in Cork, Ireland with our US HQ in Raleigh-Durham, NC.

About the Role

We are seeking an Engineering Manager to guide and support a multidisciplinary team across semiconductor device, process, and technology transfer disciplines as they deliver the technical objectives of the project portfolio. The focus of the Engineering Manager will be the implementation of best practice in programme delivery while nurturing the growth and development of the team as a whole and its individual technical contributors.

The team delivers complex projects which enable the adoption of Heterogeneous Integration using Micro Transfer Printing by global OEMs, foundries and semiconductor device suppliers. Projects can involve a broad range of technology developments with team specialists in process development (Si and III-V), wafer fabrication (front-end-of-line/back-end-of-line), packaging/assembly, and reliability qualification—from concept through production ramp.

Our Commitment to Inclusion

We welcome applicants of all genders, identities, backgrounds, and experiences.

Qualified candidates who may not meet every identified preferred skill are still encouraged to apply. We are committed to a workplace where everyone is respected, supported, and able to contribute fully.

Salary and benefits commensurate with experience and skills of the successful candidate.

Key Responsibilities

Customer & Stakeholder Engagement

• Liaising with the Technical Lead, serve as the primary program point of contact to align specifications, implement change control and acceptance tests with the external customer and internal stakeholders in Business Development, Operations and Supply Chain.
• Communicate trade-offs, risks, and mitigation strategies with evidence-based recommendations.

Team Guidance & People Development

• Provide day-to-day support to the team of engineers and scientists across process integration, device engineering, PDK/modeling, yield/reliability, test, and packaging.
• Foster an inclusive, collaborative environment that enables knowledge sharing, mentoring, and growth for early-career and senior contributors.
• Develop staffing plans, roles and succession plans; conduct performance coaching aligned to measurable technical outcomes.

Project Planning & Management

• Own customer expectations for projects and timelines
• Coordinate integrated project plans including scope, schedules, resource allocation, dependencies, and risk mitigation (technical, schedule, and supply-chain).
• Guide the team in translating customer Statements of Work (SOWs) into actionable work packages with acceptance criteria.
• Apply and support the use of appropriate project management processes (Agile, Stage-gate…); track progress and report metrics.

Technical Direction & Execution

• Oversee process development across lithography (CD/overlay), etch, thin films (PVD/CVD/ALD), and wet cleans; ensure robust process windows.
• Guide device and technology development (FEOL/BEOL), including TCAD-informed design & layout considerations and PDK.
• Drive yield learning using pareto analysis, excursion management, SPC (X‑R, Cpk), fault-isolation, and FMEA (DFMEA/PFMEA).
• Oversee the development of test strategies (wafer sort, final test) and characterization (IV/CV, RF/S-parameters as applicable), building automated data pipelines and dashboards.

Process Improvement & Operational Excellence

• Champion continuous improvement in R&D and quality processes.
• Standardize documentation (SOWs, specs, work instructions, process transfer).
• Promote a strong Environmental, Health & Safety culture for cleanroom operations and equipment safety; drive audit readiness and compliance.

Required Qualifications

• Master’s degree or PhD in Electrical/Electronic Engineering, Materials Science, Physics, Chemical Engineering, or related semiconductor discipline.
• 7+ years of experience in semiconductor R&D or manufacturing.
• 5+ years of engineering R&D management.
• Hands-on experience in at least two of: process integration, device engineering, yield engineering, reliability/quality, or test development.
• Ability to read/author SOWs/specs and convert them into DOEs, control plans, verification reports, and release documentation.

Preferred Qualifications

• Experience with Agile and/or Stage-Gate methodologies for technology development and portfolio governance.
• Familiarity and Exposure to PDK development/maintenance and correlation between device models and silicon measurements.
• Experience collaborating with equipment vendors and OSATs; understanding of mask/reticle flow and change management.

Core Competencies

• People Development: Coach, mentor, and provide actionable feedback; build diverse, high-performing teams and succession plans.
• Communication: Produce concise technical documents and executive updates; tailor depth to audience; present complex data with clarity.
• Operational Excellence: Drive standard work, continuous improvement, and right-first-time execution; uphold safety and quality culture.
• Decision Quality: Make timely, data-driven decisions under uncertainty; frame trade-offs and escalate risks with clear justifications.
• Technical Depth & Systems Thinking: Connect device physics, unit processes, integration, yield, test, and reliability to optimize end-to-end outcomes.
• Stakeholder Engagement: Align cross-functional partners (Design, Ops, QA, Supply Chain, Finance) and customers around priorities and milestones.
• Customer Orientation: Translate requirements into CTQs and measurable outcomes; manage change control and expectation setting.

For further information please contact us at info@x-celeprint.com, referencing “R&D Manager Position”

Job Types: Full-time, Permanent

Pay: €60,000.00-€100,000.00 per year

Benefits:

• Company pension
• Private medical insurance
• Sick pay

Work Location: In person