Senior Scientist - Advanced Wafer Level Packaging (All Genders) // Job-Id: 239-1

To strengthen our interdisciplinary research team, we are seeking a highly motivated researcher/engineer in the field of heterogeneous integration and advanced packaging. In this role, you will work on cutting-edge technologies at the intersection of microelectronics, photonics, and RF systems, contributing to innovative developments from concept definition through fabrication and characterization. You will take an active role in challenging research and development projects and collaborate closely with industrial and academic partners.

• Conduct research and development in the field of heterogeneous integration technologies
• Design, fabricate, and evaluate advanced packaging solutions such as RF/Si/photonic interposers and co-packaged optics
• Develop technology concepts, plan Design of Experiments (DOE), and perform process and device characterization
• Carry out microfabrication and backend processing in a cleanroom environment
• Contribute backend and packaging solutions to a variety of industrial and collaborative projects
• Perform data analysis and interpretation of experimental results
• Prepare technical reports, internal documentation, and support scientific publications and presentations
• Take responsibility for project management, including coordination of tasks, timelines, and technical deliverables

• Ph.D. in Physics, photonics, microsystems fabrication, and electronics engineering or relevant industrial experience
• 5+ years of experience in a relevant field are required
• In-depth knowledge and hands-on experience with advanced packaging processes such as interposers, Photonic packaging, chiplets, FOWLP
• Experience with wafer bonding, die to wafer bonding, and chip interposers
• Good understanding of signal and power integrity in interposers
• Familiarity with BGA, WLCSP, SiP, MCM, AiP, AoP, SoC design rules
• Project management experience as well as research funding proposals
• Fluent oral and written communication skills in English, knowledge of German is a plus

• Diverse research activities with many technical challenges.
• State-of-the-art laboratory facilities and equipment.
• Location in the heart of Europe in Austria – relocation support for non-European nationalities.
• Internal and external training opportunities for career development.
• Family & children friendly - actively shaping the compatibility of family and career.
• “Vital4SAL” to promote a healthy workplace (e.g. SAL coaching pool, trainings on mental health, physical activities, healthy snacks, 24/7 accident insurance)
• € 4 per day meal allowance in restaurants or € 2 per working day in supermarkets.
• Public transport initiative (subsidy for the “Klimaticket”)
• Start: as soon as possible

This position is subject to the Collective Agreement for employees in non-university research (Research CA) starting in occupational group F (F1 salary = EUR 4.757,- paid 14 times a year, based on 38,5 hours per week). For this position we offer competitive salaries and additional benefits based on your experience and qualifications, starting with a minimum gross salary of EUR 70.000 (annual, based on an All-in contract and bonus).

Silicon Austria Labs (SAL) is a top research center for Electronics and Software Based Systems (ESBS). At three locations (Graz, Villach, Linz), SAL is conducting research along the entire ESBS value chain in the areas of sensor systems, power electronics, intelligent wireless systems, microsystems and embedded systems to develop future-oriented solutions for industrial production, health, energy, mobility, safety and more. SAL brings together key players from industry, science and research and thus valuable expertise and know-how and conducts cooperative, application-oriented research along the value chain. Cooperative projects are co-financed by SAL and enable a fast and unbureaucratic project start. SAL is thus shaping the high-tech location Austria and Europe and developing the future